IC Package Technical Lead (W/M) > Caen > Joboolo FR :
Société : RHESO.TECH Lieu : Caen
IC PackageTechnicalLead (W/M) Contract Type:
Full-time (CDI) Location:
Caen Ref:
1302 Contact:
Recruiting Company:
French fabless semiconductor manufacturer specialized in the design and marketing of highly integrated, mixed-signal semiconductor products for markets demanding wideband and low power analog-to-digital, digital-to-analog conversion.
Role:
A dynamic and experienced IC packagetechnicallead to drive all package related activities with our assembly partners, including the choice and materials development, to create outstanding products in a dynamic environment.
Responsibilities:
Serve as focal point for all packaging-related matters.
Collaborate closely with assembly centers and the design/R&D team to define and specify IC packages.
Work with the IC design team to define and/or design reliable BGA package substrates using CAD tools.
Prepare documentation for BGA substrate design approval and first procurement under QA policy.
Lead the selection of advanced packaging materials with standard and innovative solutions to meet total product package performance requirements across product application domains.
Conduct feasibility studies for early assessment of substrate technology and electrical performances.
Collaborate with assembly center R&D teams for continuous improvement of design performance.
Execute and/or drive Electrical, Thermal and Mechanical Modeling in collaboration with assembly partners.
Contribute to the integration of solutions into customer applications on packaging-related aspects and the implementation of thermal dissipation systems.
Requirements:
You hold an MSc in Electrical Engineering or equivalent, with over 5 years hands-on experience in defining, selecting, and qualifying IC packages, strongly understanding of IC package assembly development process.
You demonstrate expertise in high-performance Flip-Chip BGA packaging for large-scale, high-speed/power IC.
You have experience evaluating impact of packaging on PCB design, board, system integration, high-speed, RF.
You excel at system-level thermal dissipation technologies:
through board, heat spreader, heat sink, fan.
Your pluses:
thermal simulation, RF, die-to-die interconnect Technologies, design tools, French language.
You demonstrate analytical and problem-solving skills, are a team player with a critical attitude and sense of initiative, communicate fluently in oral and written English, are ready to travel occasionally to assembly lines.
Education:
BAC5, Master's Degree RHESO.TECH, a specialized recruitment agency https:
